Ahead of the mandatory enforcement of the GB 47372-2026 safety standard for power banks on April 1, 2027, the portable power bank sector faces a sweeping technological transition. With six strict mandates—including dual independent safety barriers, precision cell tracking, and complete lifecycle data logging—projected to clear out non-compliant volume, NSING has introduced a comprehensive turnkey chip platform. Drawing on its four proprietary silicon portfolios spanning precision fuel gauges, primary MCUs, BLE SoCs, and PD fast-charge controllers, this closed-loop ecosystem helps manufacturers navigate new regulatory compliance and upgrade to premium integrated designs.
The platform anchors advanced cell analytics and intelligent oversight through high-precision fuel gauges (NB401/NB201), which pack dual 16-bit ADCs and historical tracking to hold measurement error to 1% at ambient and <=3% across extreme temperatures, backed by dual-IC redundancy and lifecycle event logging.
System control scales efficiently via the N32 MCU family (G03x, L406, G45x), addressing varied requirements from basic numeric displays to high-capacity outdoor power stations. Integration with N32WB low-power Bluetooth SoCs adds real-time visual telemetry, smart app connectivity, and Bluetooth asset tracking.
Meanwhile, NP11/NP12 fast-charging SoCs support PD3.1 and UFCS with active thermal current limiting tied directly to the fuel gauge data to suppress overtemperature risks.
By unifying independent MCUs or BLE processors with precision gauging and PD protocols, NSING delivers an out-of-the-box architecture that cuts qualification timelines and vendor fragmentation. As tightening safety standards elevate market expectations, this integrated platform not only meets strict regulatory baselines for safety and traceability, but also infuses end products with rich smart features. These unified, high-reliability silicon solutions are set to drive the next wave of safe, premium-tier portable energy products.
Related Articles：
1. Southchip SC8723: A High-Integration Solution for Compact Buck-Boost Power
2. iCM Chip Joins Tesla Supply Chain: A Milestone for China’s Semiconductor Industry
3. RUNXIN's GaN Chips Enter Philips Supply Chain
