As fast charging pushes toward smaller footprints and higher efficiency, integration is the key to managing costs and power density. Hynetek’s new HUSB370 Power Delivery chip delivers a major architectural leap by packing the N-MOSFET, sense resistor, and protocol logic into a compact ESSOP-10L package.
This minimalist design needs only two peripheral capacitors, saving valuable board space and simplifying development. With a standby current of just 100 microamperes and support for zero-standby AC-DC algorithms, it keeps total power consumption under 5 milliwatts—an ideal, cost-effective choice for gallium nitride chargers, car chargers, and multi-port power solutions.
The HUSB370 excels by balancing performance with broad compatibility. It supports the Universal Fast Charging Specification (UFCS), USB Power Delivery 3.2, AVS, and DPS, along with major proprietary protocols like QC, AFC, FCP, and SCP. For developers, the integration of Multi-Time Programmable (MTP) memory and C language support offers a massive advantage over static OTP solutions, allowing for easy parameter tuning throughout the product lifecycle. Built-in safeguards—covering overvoltage, overcurrent, undervoltage, and overtemperature—ensure robust protection, reducing the need for extra external components while maximizing system reliability.
The HUSB370 signals that fast charging design has reached a new stage of high integration. For manufacturers, it cuts BOM costs and improves manufacturing reliability, while its programmable firmware helps teams stay ahead of evolving industry standards. Moving forward, the HUSB370 will be a vital tool for driving innovation, enabling smaller, more efficient, and smarter charging solutions that deliver a superior user experience.
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