Semiconductor Giants Converge at 2026 World Power Bank Conference to Drive Compliance with New National Standards

With the formal release of China’s first mandatory national standard for mobile power, GB 47372-2026 "Technical Specification for Mobile Power Safety," effective April 1, 2027, the industry has entered a critical period for compliance upgrades. To assist manufacturers in navigating policy trends and overcoming technical barriers, ChargerLAB, in collaboration with Dianchi, hosted the 2026 World Power Bank Conference in Nanshan, Shenzhen, on June 26. The event featured industry leaders such as INJIONIC, iSmartWare, Chipsea, FMSH, and Realmagic, focusing on frontiers including safety compliance, high-precision BMS monitoring, PD/UFCS VDM wired communication, NFC intelligent identification, 2mm-level active cooling, and Find My localization to establish a next-generation technical closed-loop for safe, intelligent, and low-carbon mobile energy chips.

In response to the new standard's rigorous requirements for protection mechanisms, information reading, anomaly recording, and battery monitoring, major chip manufacturers debuted their proprietary hardware and IC solutions. INJIONIC’s flagship bidirectional buck-boost SoC, the IP5385, has passed preliminary new standard testing, supporting 2–6 series battery cells with integrated 14-bit ADC fuel gauging. iSmartWare showcased the new SW632X series, which handles core indicators like 240W dual-independent fast charging, low-cost serial communication, and TFT color display integration. Chipsea's CV6056/CV6056D SoC and Powlicon’s PL62100 provide highly integrated solutions for wireless and wired fusion, while Chipsea Technology’s CBM8582 and FMSH’ NFC/security chip solutions evolve power banks into traceable, intelligent IoT terminals. Additionally, Realmagic introduced its disruptive "MagicCool" 2mm piezoelectric fan technology, which provides active thermal control for high-power products without significantly increasing device bulk.

The 2026 World Power Bank Conference signifies the industry's shift from price-driven competition to high technical barriers and strict compliance. While the new national standard raises market entry thresholds, it opens significant high-end opportunities for brands with strong chip capabilities and engineering execution. Success in this landscape belongs to those who can integrate high-integration SoCs with advanced security, tracing systems, and innovative cooling solutions to deliver safer, smarter, and more compact Chinese power technology to the global market.