Navitas Semiconductor has introduced its next-generation GaNSlim™ GaN power chip series, designed to simplify high-power-density applications with unmatched integration and efficiency. GaNSlim™ chips, built on the proprietary DPAK-4L package, offer exceptional heat dissipation and integrated EMI control, reducing the need for external components and cutting costs. These chips also feature lossless current sensing and intelligent power management, enhancing the overall design efficiency and reliability.
Targeted toward markets like mobile and laptop chargers, TVs, and solid-state lighting, GaNSlim™ promises industry-leading power density. With a low startup current below 10µA, the GaNSlim™ series meets strict standby power requirements without high-voltage components, which broadens its compatibility. Additionally, GaNSlim™ incorporates Navitas’ advanced thermal management, operating at temperatures 7°C lower than traditional packages, making it capable of supporting up to 500W of power output.
Designed for applications up to 500W, GaNSlim™ enables smaller, higher-performance products and is actively deployed in over 50 projects. With ratings up to 700V and RDS(ON) from 120mΩ to 330mΩ, GaNSlim™ offers options for isolated and non-isolated topologies. Alongside a 20-year limited warranty, Navitas provides demo boards to facilitate product evaluation across various configurations, including flyback, PFC, and TV power supply designs.
Navitas reports that GaNSlim™ is being used in over 50 active projects, spanning both isolated and non-isolated topologies. With its 20-year limited warranty and a variety of demo boards, the GaNSlim™ series offers a new standard in compact, efficient power solutions for high-demand applications, underscoring Navitas’ commitment to high-integration, user-friendly semiconductor solutions.
